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FR4 CEM1 FR1 3u'' Prototyping Multi Layer PCB 350um BGA Immersion Gold

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Abis Circuits Co., Ltd.

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FR4 CEM1 FR1 3u'' Prototyping Multi Layer PCB 350um BGA Immersion Gold

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FR4 CEM1 FR1 3u'' Prototyping Multi Layer PCB 350um BGA Immersion Gold

Immersion Gold 3u'' Printed Circuit Board from Prototyping to Volume Production Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, ...

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FR4 CEM1 Multi Layer PCB

3u'' Prototyping Multi Layer PCB

350um BGA Multilayer Pcb Board

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